5 energy way, west warwick, ri 02893 usa tel: 800-424-9850 / 401-823-5200 fax: 401-823-8723 e-mail: info@advintcorp.com internet: www.advintcorp.com rev. 8/01 products shown covered by patents issued and/or pending. specifications subject to change without notice. dimens ions shown: inch/(mm) . true bga socket? features ? no soldering of bga device required. ? aic exclusive eutectic solder ball terminals offer superior processing. ? uses same footprint as bga device. ? designed for production, develop- ment, programming and test applica- tions. ? compact design maximizes pcb real estate: tsg = device pkg. size + 0.216/(5.5mm) tsh = device pkg. size + 0.374/(9.5mm) ? available with integral, finned heat sink or coin screw clamp assembly. ? currently available in 1.0 and 1.27mm pitch. ? new short slide clamp reduces required installation space on pcb. specifications terminals: brass; copper alloy (c36000) terminal support: polyimide film contacts: beryllium copper (c17200) plating: g C gold over nickel spring material: beryllium copper clamp assembly: aluminum (heat sink/coin screw, clamp, support plate) insulator material: molded pps (high temp. glass filled thermoplastic), u.l. rated 94v-o, -60 c to 260 c (-76 f to 500 f) solder ball: eutectic, 63sn/37pb,183 c (361 f) true bga socket? ball grid array sockets type -690 surface mount type -708 thru-hole standard terminals for test, development and production applications .183 (4.65) .125 (3.18) .018 dia. (0.46) .183 (4.65) .030 dia. (0.76) type -712 type -713 terminals for lga or de-balled bga device applications .030 dia. (0.76) .193 (4.90) .193 (4.90) .125 (3.18) .018 dia. (0.46) type -657 type -709 type -659 terminals for bga device test applications (consult factory for availability) .183 (4.65) .125 (3.18) .018 dia. (0.46) .183 (4.65) .125 (3.18) .016 dia. (0.41) .030 dia. (0.76) .183 (4.65) how it works step 1 ? solder true bga socket? to pcb step 2 ? align and place bga device on top of true bga socket mating con- tacts. place chip support plate over bga device. step 3 ? slide clamp over assembly. allow space on pcb for sliding clamp [approximately 33% of device package size on one side only with new short slide clamp]. refer to clamp sliding directions for pin 1 location (see page 4). step 4 ? tighten coin screw or finned heat sink to engage compression stroke. support plate bga device solder ball reflowed p.c.b. advanced compression stroke (step 4) polyimide wafer guide box heat sink clamp coin screw or finned heat sink p.c.b. advanced bga how to order number of positions *see bga footprint booklet or web site x ts g xxxx - 690 g g xx true bga socket pitch g = .050/(1.27mm) pitch h = .039/(1.0mm) pitch terminal plating g - gold contact plating g - gold clamp options yh - heat sink (3 fins std.) yc - coin screw terminal type see options above footprint dash # if applicable* 1.27mm pitch terminal options support plate not shown mechanical specifications for bga device package required for quoting/ordering. patented .024/(0.61) dia. .162 (4.11) .125 (3.18) .011 dia. (0.28) type -752 surface mount type -754 thru-hole 1.0mm pitch terminals for test, development and production applications .162 (4.11) 5
5 energy way, west warwick, ri 02893 usa tel: 800-424-9850 / 401-823-5200 fax: 401-823-8723 e-mail: info@advintcorp.com internet: www.advintcorp.com rev. 8/01 products shown covered by patents issued and/or pending. specifications subject to change without noti ce. dimensions shown: inch/(mm) . patented pop-top ? action finned heat sink (3 fins std. consult factory for options) solder joint solder ball .050 (1.27) bga adapter socket pop-top ? bga socket adapter system pop-top ? system features ? designed for large i/o bga devices. ? patented limited-stroke terminal design allows ultra low insertion and extraction. ? aic patented eutectic solder ball terminals offer superior processing. ? compact design maximizes pcb real estate C only 0.139/(3.52mm) nomi- nal wider than bga device body size on clip side. ? uses same footprint as bga device. ? currently available in .050/(1.27mm) pitch. ? available with integral, finned heat sink or coin screw. specifications terminals: brass; copper alloy (c36000), astm-b-16 contacts: beryllium copper; copper alloy (c17200), astm-b-194 plating : g C gold over nickel body material: molded pps (high temp. glass filled thermoplastic), u.l. rated 94v-o, -60 c to 260 c (-76 f to 500 f) solder ball: eutectic, 63sn/37pb, 183 c (361.4 f) how it works step 1 ? solder bga socket to pcb. step 2 ? solder bga device to adapter. step 3 ? align and insert device/ adapter assembly into bga socket. step 4 ? slide retention clamp over entire assembly. ? turn coin screw (cs) or number of positions *see bga footprint booklet or web site x pts xxxx - 636 g g hs terminal plating g - gold contact plating g - gold clamp options hs - heat sink (3 fins std.) cs - coin screw qh - heat sink w/ support plate qs - coin screw w/ support plate 1.27mm pitch terminal type footprint dash # if applicable* model type pts = pop-top w/ short slide clamp new short slide clamp retention clamp sliding for high density pc boards direction for pop-top ? (also standard on true bga socket?) and true bga socket? ? reduces required installation space (clearance for sliding clamp) by 50 to 75% how to order 2. after travel & lock down with screw or heat sink to point b b 1. "zero" insertion to point a a travel finned heat sink (hs) to engage adapter into socket and lock down advanced pin 1 indicator always shown in lower left corner on advanced footprint drawings.* retention clamp slides to mechanical stop on socket. slide on slide off *refer to bga footprints booklet or aic web site for drawings advanced advanced clearance needed approx. 33% of device package size on one side only mechanical specifications for bga device package required for quoting/ordering. 4
5 energy way, west warwick, ri 02893 usa tel: 800-424-9850 / 401-823-5200 fax: 401-823-8723 e-mail: info@advintcorp.com internet: www.advintcorp.com rev. 8/01 products shown covered by patents issued and/or pending. specifications subject to change without notice. dimens ions shown: inch/(mm) .
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